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Our Services
PCB Assembly
Rapid-Prototyping
New Product Introduction
Box Assembly And Integration
PCB Design & Engineering
PCB Fabrication
Quality Test & Burn-in
Failure Analysis
Mechanical Design & Engineering
Plastic injection moulding
Sheet metal fabrication
Wire & Cable Harness
Supply chain & Logistic
PCB Assembly Capabilities
High Complex Double side PCB Assembly
High Mix Low to Medium Assembly
Follow RoHS compliances
SMT, THT and Mixed Technology assemblies
3D Solder Paste Inspection(SPI)
3D Automated Optical Inspection(AOI)
3D Automated X-Ray Inspection (ICT)
IPC Standards Class 2 and Class 3
Latest Component Technologies
Conformal Coating, Encapsulation
Total Traceability
PCB Assembly
Quick turn PCB assembly shortens the product development cycle and requires efficiency and precision. With an attention to detail and precise execution, CINT offers end-to-end assembly services from prototype board design and assembly to high-volume printed circuit board assembly.
With a broad range of manufacturing capabilities from simple single-sided assemblies to complex densely populated fine pitch and BGA surface mount assemblies, CINT manufacturing lines are designed to achieve maximum performance in various application and technology sectors.
CINT Electronics capabilities include:
Expertise in single, multi-layer flexible and rigid circuitry boards
Thorough design review prior to starting the assembly
Consignment or full turnkey solution
In-depth knowledge of various application requirements
Proficient in surface mounting, through-hole and mixed technology
Prompt response to design changes, requirement updates and questions
State-of-the-art advanced manufacturing equipment
Stringent quality inspections
Full compliance to RoHS standards
Reliable, repeatable precision services maximizing quality and reducing cost
Maximum Thermal Performance
The reliable and efficient reflow system for high-end production requirements. Lead-free 8+2 zone ovens deliver high-performance thermal processing. The Reflows set the standard in innovative technologies that save on the lowest power.
The standard conveyor system
8 zone process capability and control
Prevents oxidation of solder-able surfaces (promotes wetting) and of the molten solder, allowing for the reduction of void levels
Stronger solder joints and shiny finish
System Box Build Assembly and Integration Services
The production of a printed circuit board includes much more than the actual assembly of the board.
Other processes include sub-assembly installation, cable assemblies, wiring harnesses, and fabrication of board enclosures. All these components must work together to ensure a fully-functional circuit board.
CINT provides a full range of sub-assembly, box-build, and integration services customized to each individual product.
System/Box-Build activities include:
System Level Assembly
Product Assembly
Sub-Level Assembly
Testing (functional & environmental)
Software Loading
Product Configuration
Packaging & Labeling
Test & Burn In
Manufacturers need to understand the predictable lifetime of their products to provide a warranty without expecting a significant number of failures.
Early failures occur because of various types of issues that may happen during the manufacturing process. Our Electronic tests and burn-in process at the component level eliminate defective parts at the early phase of the product life to ensure product reliability.
CINT processes include:
Electrical and mechanical test of the board
Inline 3D SPI
Inline 3D AOI
3D X-Ray (CT)
Functional test at board level
Functional test at system level
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